Realme is all set to launch a new smartphone under its X-series. It is being rumoured that the device will be called Realme X9, and not Realme X7. One of the teasers from the company suggests that the alleged Realme X9 series will offer a glass back panel with an iridescent finish, similar to Realme V15 and X7 pro smartphones.
GSMArena claims that the Pro version of the same device will be powered by MediaTek Dimensity 1200 processor. This is a flagship MediaTek chipset, which is based on 6nm process.
The brand’s CEO Madhav Sheth confirmed on Twitter that the upcoming Realme X-series phone will offer this MediaTek SoC. A few days back, the executive shared an image of the alleged Realme X9 smartphone, showing it will feature Realme’s ‘Dare to Leap’ branding at the back. The device will also likely sport a loudspeaker grille, a USB Type-C port, and a microphone at the bottom. However, there might not be a 3.5mm headphone jack, as per the teaser.
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